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dc.contributor.authorBerner, A.-
dc.contributor.authorFuks, D.-
dc.contributor.authorEllis, D. E.-
dc.contributor.authorMundim, Kleber Carlos-
dc.contributor.authorDorfman, Simon-
dc.creatorBerner, A.-
dc.creatorFuks, D.-
dc.creatorEllis, D. E.-
dc.creatorMundim, Kleber Carlos-
dc.creatorDorfman, Simon-
dc.date.accessioned2012-11-13T18:04:08Z-
dc.date.issued1999-
dc.identifier.issn0169-4332-
dc.identifier.urihttp://www.repositorio.ufba.br/ri/handle/ri/7197-
dc.descriptionp.677–681pt_BR
dc.description.abstractFormation of Cu–C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu–C composite leads to the formation of a thin (approximately 50 nm) interface which provides the bonding between fiber and matrix. The HR SEM study displays the formation of small copper nano-crystals in the interaction zone. This structure of the interface is predicted by molecular dynamic and Monte Carlo simulations with semi-empirical repulsive Cu–C interatomic potentials. We show that inclusion of a small amount of carbon in fcc copper leads to strong deformation of the copper host matrix in the vicinity of carbon. Decrease of stresses in the lattice may be reached by the formation of the developed surface in nano-crystalline structure.pt_BR
dc.language.isoenpt_BR
dc.publisherElsevierpt_BR
dc.sourcehttp://dx.doi.org/10.1016/S0169-4332(98)00897-6pt_BR
dc.subjectInterfacespt_BR
dc.subjectNano-phasept_BR
dc.subjectSEMpt_BR
dc.subjectBondingpt_BR
dc.subjectSolid solutionspt_BR
dc.titleFormation of nano-crystalline structure at the interface in Cu–C compositept_BR
dc.title.alternativeApplied Surface Sciencept_BR
dc.typeArtigo de Periódicopt_BR
dc.identifier.numberv. 144–145pt_BR
dc.embargo.liftdate10000-01-01-
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